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Design and fabrication of the electronic modules

WL Wei Lu
WB Wubin Bai
ZG Zhi-Dong Ge
JR John A. Rogers

Last updated date: Mar 2, 2021 Views: 857 Forks: 0

original An abbreviated version of this protocol was published in Science Advances in Feb, 2021
Wireless implantable catheter-type oximeter designed for cardiac oxygen saturation
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Procedure:

  1. The circuit is designed and implemented using commercial electronic design automation (EDA) software;
  2. Laser cutter process the copper-clad polyimide, to generate the flexible printed circuited board (fPCB);
  3. Bluetooth firmware is developed on embedded software development platform: Keil uVision5;
  4. Solder the electronics components including the Bluetooth microcontroller on the fPCB;
  5. A three-dimensional (3D) mold is designed using commercial computer-aided design (CAD) software;
  6. The 3D molds are manufactured based on an aluminum plate by a three-axis milling machine;
  7. Soft encapsulation silicone is made from Silbione RTV 4420 part A and part B, mixed with 5% of Silc-Pig silicone opaque dye (pink);
  8. Films of soft silicone materials are created in the mold by drop-casting, and other films are formed by spin-casting (250 rpm) on glass slides.
  9. Both films are thermally cured at 70℃ for 30 minutes;
  10. Place the fully assembled electronic module into the molded layer; pour a solution of soft silicone to fill the voids in between electronics and the top layer; attach the glass slides with silicone films to the top;
  11. Clamp the parts together, and place the entire assembly into a 70℃ oven, curing for 30 minutes;
  12. Take out the encapsulated module;
  13. A final cutting process with a CO2 laser defines a smooth perimeter boundary for the system;
  14. A manual cutting process with a small blade define openings for the connector and switch;

Images:

                   Electronics module after encapsulation

 

Materials:

  1. Copper-clad polyimide: Cu/PI/Cu, 18/75/18 um, AP8535R, Dupont, Pyralux;
  2. Bluetooth microcontroller: NRF52832, Nordic Semiconductor Co.;
  3. Solder paste:
    1. Indalloy 290, Indium Corporation;
    2. SMDLTLFP, Chip Quick Co.;
  4. Soft encapsulation silicone: Silbione RTV 4420, Elkem Co.;

 

Equipment: 

  1. EDA software: EAGLE 8.5, Autodesk Inc.;
  2. Laser cutter: ProtoLaser U4, LPKF Co.;
  3. Embedded software development platform: Keil uVision5, Arm Holdings;
  4. CAD software: ProE Creo 3.0;
  5. CO2  laser: ILS12.75, Universal Laser Systems Inc.;
  6. Milling machine: Roland MDX 540.

 

Copyright: Content may be subjected to copyright.
How to cite：
Readers should cite both the Bio-protocol preprint and the original research article where this protocol was used:
  1. Lu, W, Bai, W, Ge, Z and Rogers, J(2021). Design and fabrication of the electronic modules. Bio-protocol Preprint. bio-protocol.org/prep899.
  2. Lu, W., Bai, W., Zhang, H., Xu, C., Chiarelli, A. M., Vázquez-Guardado, A., Xie, Z., Shen, H., Nandoliya, K., Zhao, H., Lee, K., Wu, Y., Franklin, D., Avila, R., Xu, S., Rwei, A., Han, M., Kwon, K., Deng, Y., Yu, X., Thorp, E. B., Feng, X., Huang, Y., Forbess, J., Ge, Z. and Rogers, J. A.(2021). Wireless implantable catheter-type oximeter designed for cardiac oxygen saturation . Science Advances 7(7). DOI: 10.1126/sciadv.abe0579

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