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Last updated date: Nov 10, 2024 Views: 49 Forks: 0
Email: pc688@cornell.edu; ryang@cornell.edu
Affiliation: Robert Frederick Smith School of Chemical and Biomolecular Engineering, Cornell University, Ithaca, NY, 14853, USA.
Materials and Reagents
Chemicals
General cleaning chemicals: Acetone, Ethanol, Deionized water.
Initiator: tert-Butyl peroxide (TBPO, 98%, Sigma-Aldrich)
Monomer: N-vinylimidazole (VI, 99%, Sigma-Aldrich)
Crosslinker: Divinylbenzene (DVB, 80%, Sigma-Aldrich)
Derivatization Reagent: 1,3-Propanesultone (98%, Sigma-Aldrich)
Carrier Gas: Argon gas (Ar, 99.999% purity)
Equipment
Custom-Built iCVD Reactor: Cylindrical vacuum reactor (Sharon Vacuum Co Inc.)
Filament Array: Nickel/chromium filament (80% Ni / 20% Cr, 0.5 mm diameter, Goodfellow)
Thermocouple and Feedback Loop: For monomer heating jar/chamber/filament temperature control
Deposition Stage: Temperature-controlled using a chiller
Mass Flow Controllers: For precise gas flow regulation
Butterfly Valve: For chamber pressure control
Substrates:
- Silicon wafers (P/Boron <100>, Purewafer)
- 96-well microplates (Corning 2797)
- Glass slides (Thermo Fisher Scientific)
- Petri dishes (Thermo Fisher Scientific)
- Copper foil (MTI Corporation)
- PVC sheets (McMaster-Carr)
- Glass fiber filters and polycarbonate membrane filters (Sigma-Aldrich)
Customized Aluminum Holder: For enhanced cooling of microplates
HeNe Laser Source: For in situ interferometry (wavelength = 633 nm, JDS Uniphase)
Vacuum Oven: For post-deposition derivatization (VWR)
Procedure
1. Preparation of the iCVD Reactor System
2. Substrate Preparation
For 96-well microplates, use a custom-designed aluminum holder for enhanced cooling. No pre-cleaning procedure is needed.
3. Deposition Process
Material | F(1VI) (sccm) | F(DVB) (sccm) | F(TBPO) (sccm) | F(Ar) (sccm) |
P1VI | 1.65 | 0 | 0.6 | 0.85 |
CP55 | 1.55 | 0.10 | 0.6 | 0.85 |
CP26 | 1.45 | 0.20 | 0.6 | 0.84 |
CP17 | 1.32 | 0.34 | 0.6 | 0.84 |
PDVB | 0 | 1.68 | 0.6 | 0.82 |
3. When the chamber pressure reaches 500 mTorr, set the filament temperature to 230°C using the DC power supply to initiate the reaction.
4. Film Growth Monitoring
5. Derivatization of Coating
6. Post-Treatment and Cleaning
7. Characterization of Coating
Data Analysis
Calculate the deposition rate using the film thickness:
Where:
-: Change in film thickness (measured by ellipsometry) (nm)
-: Deposition time (min)
Confirm the polymer composition
Where:
-: Featured peak area
-: Featured peak area normalized by thickness obtained on homopolymer thin film
-: Molecular weight of monomer
Related files
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