Microfabrication of submicron elastomeric pillar array

TS Tae Hwan Shin
AK Abdurazak Aman Ketebo
DL Da Yeon Lee
SL Seungah Lee
SK Seong Ho Kang
SB Shaherin Basith
BM Balachandran Manavalan
DK Do Hyeon Kwon
SP Sungsu Park
GL Gwang Lee
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Photolithography was used to fabricate a silicon wafer mould with a series of holes [72]. To make the pillars, polydimethylsiloxane (PDMS) was mixed in a 10:1 ratio with its curing agent (Sylgard 184; Dow Corning, Midland, MI, USA) and vacuumed for 15 min; the mould was then spin-coated with PDMS at 1,000 RPM for 1 min and again vacuumed for 30 min to remove bubbles. The mould with PDMS was cured at 80 °C for 3 h. The pillar array was manufactured using this method. Each pillar was 900 nm in diameter (D), 1 µm in height (L), and 1.8 µm in centre-to-centre distance. To calculate the bending stiffness (k) of the pillar, the Euler–Bernoulli beam theory was applied [31]:

where E is the Young’s modulus (2 MPa) of the cured PDMS. Using this equation, the k of the pillar was calculated to be 24.2 nN/µm.

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