Photolithography was used to fabricate a silicon wafer mould with a series of holes [72]. To make the pillars, polydimethylsiloxane (PDMS) was mixed in a 10:1 ratio with its curing agent (Sylgard 184; Dow Corning, Midland, MI, USA) and vacuumed for 15 min; the mould was then spin-coated with PDMS at 1,000 RPM for 1 min and again vacuumed for 30 min to remove bubbles. The mould with PDMS was cured at 80 °C for 3 h. The pillar array was manufactured using this method. Each pillar was 900 nm in diameter (D), 1 µm in height (L), and 1.8 µm in centre-to-centre distance. To calculate the bending stiffness (k) of the pillar, the Euler–Bernoulli beam theory was applied [31]:
where E is the Young’s modulus (2 MPa) of the cured PDMS. Using this equation, the k of the pillar was calculated to be 24.2 nN/µm.
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