Silicon wafers were O2-plasma activated (300 W, 2 min) and vapor phase silanized in vacuum (Trichloro(1H,1H,2H,2H-perfluorooctyl)silane, 1 h, Sigma Aldrich). The silanized wafers were spin coated with a release agent (Ease Release 205, 3000 rpm, 20 s, Mann Release Technologies). PDMS (Sylgard 184, Dow Corning) was spin coated (500 rpm, 30 s) and semi-cured on a hotplate (65 °C, 10 min). Membranes with deposited AgNWs were baked (100 °C, 10 min) and put in contact with the PDMS layer under pressure and heat (100 °C, 5 min). The membranes were peeled of leaving the AgNWs on the PDMS surface. SEM images were taken with a Zeiss SUPRA 50 VP (acceleration voltage 5–10 kV).
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