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The formulation, printing, and curing of the VegPU/Ag ink

JL Jian Lv
GT Gurunathan Thangavel
YX Yangyang Xin
DG Dace Gao
WP Wei Church Poh
SC Shaohua Chen
PL Pooi See Lee
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The VegPU resin was mixed with Ag flakes at a weight ratio of 4:5 by 3 h shaking on a vortex (MX-S, Dlab). The printing pattern was designed by Auto CAD software and printed by a stainless-steel stencil (Micro Tech Technology, Shenzhen, China) with a thickness of 100 µm produced by laser cutting. Then, the freshly printed samples were immediately immersed in the curing solution containing 100 mM NaCl and 17 mM lactic acid. After 30 min soaking, the printed electrodes were dried in the oven at 60 °C for 3 h. The water- and heat-treated electrodes were produced by putting the freshly printed electrodes in the DI water for 30 min and in the oven at 80 °C for 4 h, respectively.

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