DCB specimens of different material systems were prepared by 3D printing. The material systems included epoxy-epoxy, epoxy-carbon fiber (CF) composites, and polymer-silicone interfaces. We 3D printed epoxy and its composites into DCB specimens using direct ink writing (DIW) method. The inks were prepared based on our previously reported literature53. Briefly, epoxide resin (Epon 826®) was mixed with cross-linkers (Epikure W®, 25 wt%, and Epikure 3140®, 5 wt%), and silica nanoparticles (EH-5®, 13 wt%) using a planetary mixer. Carbon fibers (10 wt%) were added to the mixture to prepare the epoxy-CF composite ink. The as-prepared inks were 3D printed by DIW technique using a Hyrel 3D SR Engine® printer with a nozzle size of 0.3 mm, layer height of 0.15 mm, and a printing speed of 10 mm/s. After printing, the materials were thermally cured at 150 °C for 10 h. For polymer-silicone samples, we used stereolithography (SLA) to 3D print polymer beams (Formlab® Tough resin), which were then washed by isopropyl alcohol (IPA) and cured at 60 °C for 60 min. Then, a layer of silicone glue was applied at interface and cured at room temperature for at least 2 h. The polymer-silicone samples had a beam thickness of 5 mm, a beam width of 20 mm, a length of 100 mm and an initial crack length of 25 mm (ASTM D5528 standard). A scaling factor of 0.8 was used for epoxy and epoxy-CF samples to reduce the 3D printing time. Different material properties were considered in FEA validations, where Epol = 1.5 GPa for SLA printed polymer beams, Eepoxy = 1.6 GPa and Eepoxy-CF = 2.2 GPa for DIW printed epoxy and epoxy-CF samples, respectively. DCB tests were performed via a universal tensile machine under displacement control (0.1 mm/s) up to 10 mm. F–D curves are collected at 10 pts/s.
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