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2.2.6. Sputtering

NN Noah U. Naef
SS Stefan Seeger
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For flow devices the negative was placed on top of the coated coverslip and all were placed inside a sputter coater. The targets of less noble metals, such as copper, molybdenum and nickel, were scrubbed with iron wool just prior to use. The surface was sputtered to 20 nm thickness. A second mirrored sample with a 3 mm hole at the other end was produced in the same fashion.

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Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).

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