We obtained few-layered FGT flakes with a freshly cleaved surface on Si/SiO2 substrate by our new developed scratching method (refer to section S2) through our home-made transfer station. Next, we deposited a 6-nm-thick Pt [or Ta (6 nm)/Pt (1.5 nm)] layer on the FGT surface, and the obtained FGT/Pt bilayer is air-stable and this could confirm the subsequent fabrication process. The Pt/FGT bilayer was patterned as Hall geometry by a standard e-beam lithography process, and excrescent areas were etched by ion milling. Last, the electrodes were fabricated by Ti (3 nm)/Au (50 nm) through e-beam evaporation.

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