Fabrication began with a clean glass slide (length, 75 mm; width, 50 mm; thickness, 1 mm; Corning Microscope Slides, Corning, NY, USA) coated with PDMS formed by spin-casting at 1000 rpm for 60 s followed by curing at 70°C for 1 hour. A sheet of copper-coated PI (9 μm/12 μm, copper/PI) was then laminated on top. Photolithography (AZ 5214, AZ Electronic Materials) and wet etching defined a pattern of copper traces. A 12-μm-thick layer of PI (PI-2545, HD MicroSystems), formed by spin-casting and curing at 250°C for 2 hours, served as an encapsulation layer and a means to locate the copper near the position of the neutral mechanical plane. Photolithography and reactive ion etching then defined the PI/metal/PI sheet into serpentine-shaped structures. A μ-ILED (TR2227, Cree Inc.) was placed onto the exposed pads with a small amount of solder paste (Indalloy 290, 97.0In/3.0Ag, Indium Corporation). The resulting probe was released from the glass substrate by laser cutting of the patterned PI/metal/PI sheet (ProtoLaser U4, LPKF, Germany).

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