The fabricated devices were released from the glass substrate by immersing in BOE (6:1) and rinsed with DI water. To transfer the devices onto a stretchable substrate, our previously reported tape transfer printing was used (42). The devices were picked up from the substrate using the tape (3M 3850), followed by deposition of the thin SiO2 layer (50 nm) by e-beam evaporation. A thin PDMS (1 mm thick, Sylgard 184; the ratio of monomer to cross-linker is 10:1) was prepared for the stretchable substrate and exposed by UV ozone treatment for 5 min to generate hydroxyl terminal groups on PDMS surface. Thereafter, the tape with the device was laminated onto a PDMS substrate and heated at 90°C for 10 min to form strong covalent bonding between the SiO2 on the device and the PDMS substrate. To finalize transfer printing, the acetone was applied to the sample, which allows the tape to delaminate from the substrate without leaving residue.

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