The energy release rate is the energy dissipated during fracture per unit of newly created fracture surface area, which quantifies the driving force of fracture. Crack propagation occurs when the energy release rate reaches a critical value. FEA was used to calculate the energy release at the adhesive/skin interface when the device was subjected to biaxial stretching. An axisymmetric model was adopted, with the four-node axisymmetric element CAX4R for the SIS microfluidic channels, adhesive layer, and phantom skin. J integral was used to calculate the energy release rate. Modeling results for three different cases (thin SIS devices with and without taper and thick SIS device without taper) revealed that the tapered structure and reduction of the overall thickness of the microfluidic channel effectively reduce the induced energy during stretching, which helped to avoid potential delamination.

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