Laser structuring of a copper laminate (Pyralux AP8535R) by means of ablation (LPKF U4) formed flexible printed circuit boards (PCBs) for the NFC systems. Sonication in stainless steel flux, deionized (DI) water, and IPA prepared the PCBs for mounting of active (AMS SL13A) and passive components [resistors, capacitors in 0201 package, and blue LED (OSRAM 720-LBVH9GN1P2351Z) in 0402 package] using low-temperature solder paste and a heat gun. Measurement of the resonant frequency of the NFC part of the circuit using a passive method (Keysight E4990A) confirmed the matched capacitance of the antenna and NFC chip, with adjustments as necessary via replacement of passive components. Dip coating the completed device in a solution of SIS in propyl acetate (5 wt %) three times with a 30-s drying step in between coats formed a waterproof encapsulation.

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