Gold electrodes (10 mm by 10 mm by 40 nm, with a 5-nm Cr adhesion layer) were deposited onto a silica substrate by e-beam evaporation through a shadow mask. The solutions of TMA AuNPs were drop casted onto gold and CNT/graphene electrodes separately to form ~500-nm-thick films. The as-prepared films were dried overnight and then laminated together with a face-to-face configuration. To prevent atmospheric humidity from influencing device performance, the devices were encapsulated in PDMS.

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